Moiré Sensors
nXM-1
3D measurement DMD system
for large areas
for large areas
High-speed, precise 3D large area & step measurement
nXM-1 delivers 3D measurement using the Moiré method and DMD
(Digital Micro-mirror Device). Using DMD to acquire multiple pattern images
at high speed can measure products with height depth. Since it has various FOV
(Max. 310㎜ X 310㎜), nXM-1 proves to be highly useful in measuring multiple spots,
from precision products to steps of large areas. nXM-1 is an optimal product that can use when you need to quickly measure
various structures such as PCB components and balls with a precision
of several ㎛ in a large area. In addition, multiple DMDs solve the issue of shadow,
and it is possible to provide only the DMD optical system upon a customer’s request.
(Digital Micro-mirror Device). Using DMD to acquire multiple pattern images
at high speed can measure products with height depth. Since it has various FOV
(Max. 310㎜ X 310㎜), nXM-1 proves to be highly useful in measuring multiple spots,
from precision products to steps of large areas. nXM-1 is an optimal product that can use when you need to quickly measure
various structures such as PCB components and balls with a precision
of several ㎛ in a large area. In addition, multiple DMDs solve the issue of shadow,
and it is possible to provide only the DMD optical system upon a customer’s request.
Key Features
· Various FOVs applied
· Measuring of products
with height depth
· Measuring of products
with height depth
· Applicable to the mass production line
· Fast measuring
and data acquisition
· Fast measuring
and data acquisition
· Simple measurement process
· Various data analysis
· Easy user interface
· Various data analysis
· Easy user interface
Application
Tire
PCB
Machinery
Machinery
Screw
Machinery
Specifications
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You can experience the technology of Nexensor.
You can experience the technology of Nexensor.
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| Measuring model | Measuring technology | Test content | Measuring data |
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Large-area measurement with WSI interferometers FOV extensive application | Micro Bump Height Monolayer membrane thickness measurement PCB fine pattern Processed surface roughness measurement Sensor step-difference measurement |
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Free-Form Metrology
Divided inspection possible according to product curve angels
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Inspection of lens and glass, and measurement of shapes
Inspection of OLED surfaces, and measurement of shapes
Inspection of wafer surfaces, and measurement of shapes
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Real-time measurement of transparent and semitransparent product thickness
Applicable to multi-channels
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Measurement of wafer(silicone, sapphire) thickness
Measurement of glass and film thickness
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