3D Free-Form Measuring
nXF-3
Freeform surface
measuring system
measuring system
3D surface shape measurement of products
with various curved & specular/rough surfaces
with various curved & specular/rough surfaces
nXF-3 is the world’s first product to measure the warp & bow
of highly reflective or transparent products such as wafers
and films by applying ‘deflectometry’. By providing quantitative and accurate measurement values
as well as the surface shape of products, it improves process stabilization
and efficiency. In addition, it can measure and inspect the surface shape of
various specular materials to measure warpage and dents on the film surface,
secondary battery pouch, hydrogen battery thin plate, automobile paint,
and so on, with high reliability.
of highly reflective or transparent products such as wafers
and films by applying ‘deflectometry’. By providing quantitative and accurate measurement values
as well as the surface shape of products, it improves process stabilization
and efficiency. In addition, it can measure and inspect the surface shape of
various specular materials to measure warpage and dents on the film surface,
secondary battery pouch, hydrogen battery thin plate, automobile paint,
and so on, with high reliability.
Key Features
· Inspection of shiny
or transparent product surfaces
· Various FOVs applied
or transparent product surfaces
· Various FOVs applied
· Applicable to the mass production line
· High precision
· High precision
· Simple measuring process
· Various data analysis
· Easy user interface
· Various data analysis
· Easy user interface
Application
The world’s first wafer
hard face/rough face.
development of simultaneous
measurement technology.
hard face/rough face.
development of simultaneous
measurement technology.
Wheel Mark
Wafer Warpage
Battery
Automotive
Specifications
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You can experience the technology of Nexensor.
You can experience the technology of Nexensor.
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| Measuring model | Measuring technology | Test content | Measuring data |
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Large-area measurement with WSI interferometers FOV extensive application | Micro Bump Height Monolayer membrane thickness measurement PCB fine pattern Processed surface roughness measurement Sensor step-difference measurement |
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Free-Form Metrology
Divided inspection possible according to product curve angels
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Inspection of lens and glass, and measurement of shapes
Inspection of OLED surfaces, and measurement of shapes
Inspection of wafer surfaces, and measurement of shapes
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Real-time measurement of transparent and semitransparent product thickness
Applicable to multi-channels
|
Measurement of wafer(silicone, sapphire) thickness
Measurement of glass and film thickness
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