Displacement Sensors
nXV-1
Optical Interference Displacement
& Thickness Measurement Sensor
& Thickness Measurement Sensor
High-precision,
multi-channel probe-mounted displacement
& thickness measuring sensor
multi-channel probe-mounted displacement
& thickness measuring sensor
nXV-1 uses the interference method to measure precise displacement
and thickness. The in-line format enables real-time measuring.
A measuring probe is mounted on the robot, allowing it to measure
while on the move and use for various measurements. In addition,
since thin-film separation is possible, it accurately separates the surface
and provides reliable measurement values and data disregarding coatings
on the surface. By using light sources of various wavelengths, nXV-1 measures the thickness
of transparent products such as films and glass and opaque or rough products
such as silicon and sapphire wafers. It can use for products whose thickness
is difficult to measure, such as secondary batteries (sealing thickness)
and PCB conformal coating.
and thickness. The in-line format enables real-time measuring.
A measuring probe is mounted on the robot, allowing it to measure
while on the move and use for various measurements. In addition,
since thin-film separation is possible, it accurately separates the surface
and provides reliable measurement values and data disregarding coatings
on the surface. By using light sources of various wavelengths, nXV-1 measures the thickness
of transparent products such as films and glass and opaque or rough products
such as silicon and sapphire wafers. It can use for products whose thickness
is difficult to measure, such as secondary batteries (sealing thickness)
and PCB conformal coating.
Key Features
· Accurate separation measurement
for multilayer films
· Thickness measurement
of specular surface
for multilayer films
· Thickness measurement
of specular surface
· Mounting of up
to 16 channel probes
to 16 channel probes
· Applicable to the mass production line
· Real-time measurement
and data acquisition
· Easy user interface
· Real-time measurement
and data acquisition
· Easy user interface
Application
Top surface
Bottom surface
Thickness surface
Wafer Profiles
Bare wafer top & Bottom measurement
Film
Wafer
Conformal Coating
Specifications
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You can experience the technology of Nexensor.
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| Measuring model | Measuring technology | Test content | Measuring data |
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Large-area measurement with WSI interferometers FOV extensive application | Micro Bump Height Monolayer membrane thickness measurement PCB fine pattern Processed surface roughness measurement Sensor step-difference measurement |
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Free-Form Metrology
Divided inspection possible according to product curve angels
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Inspection of lens and glass, and measurement of shapes
Inspection of OLED surfaces, and measurement of shapes
Inspection of wafer surfaces, and measurement of shapes
|
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Real-time measurement of transparent and semitransparent product thickness
Applicable to multi-channels
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Measurement of wafer(silicone, sapphire) thickness
Measurement of glass and film thickness
|
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