3D Interferometric-Sensors
nXP-1
One-shot Interferometer Sensor
High-speed measurement of shape
and warpage with one image
and warpage with one image
nXP-1 measures & inspects the surface shape of reflective materials
with one image. Since the product’s surface measures with one image,
it can be implemented on the fly, enabling quick measurement of large areas.
It is possible to inspect and measure surface defects of products
that are generally difficult to measure, such as defects on the surface
of wafer chips larger than several ㎚, warpage of camera film,
and bubble measurement on transparent surfaces. nXP-1 can also customise according to the size or shape of the product
to be measured and the specifications desired by customers.
This product is equipped with inspection and measurement solutions
to ensure the perfect quality of the mass production line.
with one image. Since the product’s surface measures with one image,
it can be implemented on the fly, enabling quick measurement of large areas.
It is possible to inspect and measure surface defects of products
that are generally difficult to measure, such as defects on the surface
of wafer chips larger than several ㎚, warpage of camera film,
and bubble measurement on transparent surfaces. nXP-1 can also customise according to the size or shape of the product
to be measured and the specifications desired by customers.
This product is equipped with inspection and measurement solutions
to ensure the perfect quality of the mass production line.
Key Features
· Measure the surface shape
of wafer and film types
with just one image
of wafer and film types
with just one image
· Bubble measurement
on transparent surfaces
on transparent surfaces
· Applicable to the mass production line
· Fast measuring
and data acquisition
and data acquisition
APPLICATIONS
Bubble
Film
IR film
Chip warpage
Specifications
Request a specification
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You can experience the technology of Nexensor.
You can experience the technology of Nexensor.
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| Measuring model | Measuring technology | Test content | Measuring data |
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Large-area measurement with WSI interferometers FOV extensive application | Micro Bump Height Monolayer membrane thickness measurement PCB fine pattern Processed surface roughness measurement Sensor step-difference measurement |
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Free-Form Metrology
Divided inspection possible according to product curve angels
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Inspection of lens and glass, and measurement of shapes
Inspection of OLED surfaces, and measurement of shapes
Inspection of wafer surfaces, and measurement of shapes
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Real-time measurement of transparent and semitransparent product thickness
Applicable to multi-channels
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Measurement of wafer(silicone, sapphire) thickness
Measurement of glass and film thickness
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