3D Interferometric-Sensors
nXR-1
Spectral interferometer sensor
Nanostructure 3D measurement technology
for multi-layer thin-film devices
The principle of the spectral interference method is to acquire a spectral interference signal by a dispersing element structure and to acquire line profile information about the surface shape of the multi-layered thin-film structure and the thickness of the multi-layered thin-film at once.
In the case of horizontal resolution, it determines by the objective lens's magnification, so it is possible to measure the surface shape of a multilayer thin film with nanometer-level precision while having a higher horizontal resolution than existing Reflectometry & Ellipsometry.
Key Features
· Real-time multi-layer thin film thickness & surface shape measurement
· Applicable to measurement of multi-layer thin film structures such as semiconductors and displays
· Applicable to the mass production line
· Fast measuring and data acquisition
· High precision
· Simple measurement process
· Various data analysis
· Easy user interface
Application
Measurement Result (Multi-layer films)
3D Thickness Information
3D Surface Information
3nd Layer : SiON Layer
2nd Layer : SiO₂ Layer
1st Layer : SiN Layer
Substrate : Si
3D Thickness Profile
Specifications
Request a specification
Contact us
Latest News
Request a sample test
Request a sample test now!
You can experience the technology of Nexensor.
Contact us
Measuring model Measuring technology Test content Measuring data
Large-area measurement with WSI interferometers
FOV extensive application
Micro Bump Height
Monolayer membrane thickness measurement
PCB fine pattern
Processed surface roughness measurement
Sensor step-difference measurement
Free-Form Metrology
Divided inspection possible according to product curve angels
Inspection of lens and glass, and measurement of shapes
Inspection of OLED surfaces, and measurement of shapes
Inspection of wafer surfaces, and measurement of shapes
Real-time measurement of transparent and semitransparent product thickness
Applicable to multi-channels
Measurement of wafer(silicone, sapphire) thickness
Measurement of glass and film thickness